The core will lead the future and work together.

Suzhou Xinhe Semiconductor Materials Co., Ltd. was established in March 2021 with a registered capital of 51.0675 million yuan. The company's address is located at No. 6 Liangfu Road, Chengxiang Town, Taicang City. (at present, the pilot scale-up base of Silicon Institute of Chinese Academy of Sciences & mdash;— Jiangsu Advanced Inorganic Materials Research Institute). The company is mainly engaged in the R & D and manufacture of semiconductor chip bonding materials, namely ceramic splitters, which are widely used in semiconductor IC packaging and LED packaging, and are the key core materials in the chip packaging process.

The company is the first domestic ceramic splitter R & D and manufacturing enterprise in China's high-end market. at present, it has completely mastered the core technology and achieved batch production in ceramic raw material preparation, molding processing, surface treatment, equipment research and development, and has passed the certification of several major customers at home and abroad and obtained batch orders. The company now has 240 team members, 2 doctoral degrees, 3 master's degrees, 34 undergraduate degrees, and a reasonable personnel structure. Three of the core members are related to the preparation, molding and sintering technology of oxide fine ceramic powder. The company has 315 square meters of office and R & D space, and 2277 square meters of R & D laboratory and production site. In addition, the company has established an industry-university-research cooperative relationship with the Shanghai silicate Research Institute of the Chinese Academy of Sciences.

The company's strategic positioning is to focus on the high-precision ceramic industry, to become a global leader in semiconductor chip bonding materials, and to set sail for the rise of Chinese semiconductors & ldquo; core & rdquo; chapter.