In the semiconductor process, packaging is an important link, and wire bonding is the main way to connect the chip to the substrate circuit. Ceramic splitter is an indispensable tool in the bonding ma
Packaging is one of the most important links in semiconductor technology, in which ldquo; wire bonding & rdquo; is the main way to realize the circuit connection between the chip and the substrate. In this process, there is a kind of tool that is indispensable, that is, ceramic cleaving knife.
Ceramic splitter (Ceramicbonding tool), also known as ceramic nozzle, is a kind of axisymmetric ceramic tool with vertical holes, which belongs to precision microstructure ceramic components. In application, the ceramic splitter is used as a wire welding tool in the wire bonding process, which can be used in the bonding packaging of thyristor, saw, LED, diode, Triode, IC chip and so on.
The following figure is the process of wire bonding (WireBonding). Through the use of thin metal wires (copper, gold, etc.) and heat, pressure and ultrasonic energy, the metal leads can be closely welded with the substrate pad, thus realizing the electrical interconnection between the chip and the substrate and the exchange of information between the chips.
The ceramic splitter acts as the welding needle in the bonding machine, just like the ldquo; sewing needle & rdquo; in the sewing machine, through which the wire can sew one chip to another chip or substrate. Because a bonding machine needs to bond millions of solder joints every day under full load, and each ceramic splitter has its own fixed service life, a new splitter needs to be replaced once the rated number of times is reached. Therefore, it is conceivable that the demand for ceramic splitters is huge.
However, no matter which type of ceramic splitter is used, it is empty talk that the performance is not up to standard. With the decreasing cost of semiconductor packaging, low-cost bonding line is imperative, so copper wire is bound to replace gold wire and become the main bonding line instead of gold wire in the future. However, the reliability of copper wire in the thermal cycle is far worse than that of gold wire, and it is also harder than gold wire and alloy wire, so it is necessary to use greater ultrasonic wave and greater bonding force in wire bonding. This requires that both the substrate and ceramic splitter need to have higher strength, better wear resistance and reliability to avoid poor packaging effect.