Features

• Long life: the ceramic material offers higher wear resistance, with a service life three times that of a conventional wedge.

• Resistance to aluminum contamination: cleaning frequency can be reduced to one-third that of conventional wedge.

Applications

• Used in power-semiconductor device packaging. Power modules such as IGBTs and MOSFETs must withstand high-frequency, high-current operation, and bond require high reliability and fatigue resistance. The wedge bonder is used for aluminum- or copper-wire bonding in a range of environments.