Xinhe Semiconductor Shines at the 2025 Munich Electronics Show, Showcasing Innovation in IC Packaging
On 28 March 2025, the three-day 2025 Munich Shanghai Electronic Production Equipment Exhibition concluded. Xinhe showcased ceramic capillaries and its newly developed wedge alongside more than 2,000 exhibitors, presenting its products to nearly 300,000 professional visitors.
Major Launch: Ultra-Long-Life Wedge
We launched domestic long-life wedge bonders with independent intellectual property rights. We use nano composite ceramic material, special surface finishing and new structure design to improve wear resistance, lower friction and keep stable bonding effect. Tests prove its service life is over 50% longer than traditional tools.
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Technology Leading the Future
During the exhibition, leaders and technical experts from companies including Huatian Technology, JCET, Tongfu Microelectronics and ASE Group visited for discussion. The website states that the company reached strategic cooperation intentions and received customized-requirement proposals from multiple leading enterprises.
Driving Growth Through Innovation, Advancing China’s Semiconductor Industry
Xinhe will continue increasing R&D investment, deepen cooperation across the value chain, and provide customers with better products and services.
