Chips for All, Co-Create Tomorrow

 

 

SEMICON China 2026 took place at Shanghai New International Expo Centre from March 2527. With the theme “Crossing Boundaries Globally, Connecting Through the Heart and the Chip”, the show gathered over 1,400 exhibitors and 160,000 industry professionals covering the whole semiconductor value chain: chip design, fabrication, packaging & test, materials and equipment.

 

 

 

 

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▏ Highlights on Site ▕

Core product showcase: the company presented bonding wires, ceramic components and packaging auxiliary materials, focusing on advanced packaging, AI computing and automotive-grade applications, and addressing needs for high-density interconnection, thermal performance and reliability.

 

 

In-depth industry exchange: the team discussed IMC crack control, Au-coated Ag wire performance optimization and BPP parameter customization with customers and industry experts, while also engaging with Southeast Asian market requirements.

 

 

Brand capability: the website states that Xinhe has gained industry recognition through consistent product quality and rapid customization services, supporting the advancement of independent control over domestically produced semiconductor materials.

 

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▏ A New Journey, Shared Success▕

Over three days, the exhibition sparked technological exchange and strengthened bonds of trust. We sincerely thank every customer and partner who visited our booth, and our industry peers for their recognition and support!

Looking ahead, Suzhou Xinhe will continue to deepen its expertise in semiconductor packaging materials, with innovative R&D, high-quality delivery, and global service at its core. We will keep pace with industry trends, expand our international presence, and work with partners worldwide to build a new ecosystem for the semiconductor industry.